Slot para memoria ram wikipedia In this round play begins with the first slot para memoria ram wikipedia active player to the immediate left (clockwise) of the dealer button, who has one of three choices, check, bet, or fold., how to win big on ladbrokes roulette, age of troy slot machine, jeux roulette gratuit 777, dang ky casino, orbital slot. Double Data Rate Synchronous Dynamic Random-Access Memory, officially abbreviated as DDR SDRAM, is a double data rate (DDR) synchronous dynamic random-access memory (SDRAM) class of memory integrated circuits used in computers. DDR SDRAM, also retroactively called DDR1 SDRAM, has been superseded by DDR2 SDRAM, DDR3 SDRAM and DDR4 SDRAM.
Two types of DIMMs: a 168-pin SDRAM module (top) and a 184-pin DDR SDRAM module (bottom). The SDRAM module has two notches (rectangular cuts or incisions) on the bottom edge, while the DDR1 SDRAM module has only one. Also, each module has eight RAM chips, but the lower one has an unoccupied space for the ninth chip.
Three SDRAM DIMM slots on a computer motherboard
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- A DIMM or dual in-line memory module comprises a series of dynamic random-access memory integrated circuits.These modules are mounted on a printed circuit board and designed for use in personal computers, workstations and servers.DIMMs began to replace SIMMs (single in-line memory modules) as the predominant type of memory module as Intel P5-based Pentium processors began to gain market share.
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A DIMM or dual in-line memory module comprises a series of dynamic random-access memoryintegrated circuits. These modules are mounted on a printed circuit board and designed for use in personal computers, workstations and servers. DIMMs began to replace SIMMs (single in-line memory modules) as the predominant type of memory module as IntelP5-based Pentium processors began to gain market share.
While the contacts on SIMMs on both sides are redundant, DIMMs have separate electrical contacts on each side of the module. Another difference is that standard SIMMs have a 32-bit data path, while standard DIMMs have a 64-bit data path. Since Intel's Pentium, many processors have a 64-bit bus width, requiring SIMMs installed in matched pairs in order to populate the data bus. The processor would then access the two SIMMs in parallel. DIMMs were introduced to eliminate this disadvantage.
Variants[edit]
Variants of DIMM slots support DDR, DDR2, DDR3 and DDR4 RAM.
Common types of DIMMs include the following:
SDRAM | SDR SDRAM | DDR SDRAM | DDR2 Wheel of fortune wii game 8. We have tried hard to make this as simple as possible to use. We are constantly updating these answers so that you are set for 2018. Wheel of Fortune Mobile App Answers! We've got you covered for when you are stuck on a puzzle!We've got all your answers for the Wheel Of Fortune Mobile App Game! Let us know if we can improve upon anything. | DDR3 SDRAM | DDR4 SDRAM | FPM DRAM и EDO DRAM | FB-DIMM DRAM | |
---|---|---|---|---|---|---|---|---|
DIMM | 100-pin | 168-pin | 184-pin | 240-pin[a] | 288-pin | 168-pin | 240-pin | |
SO-DIMM | N/A | 144-pin | 200-pin[a] | 204-pin | 260-pin | 72-pin/144-pin | N/A | |
MicroDIMM | N/A | 144-pin | 172-pin | 214-pin | N/A | N/A |
70 to 200 pins
- 72-pin SO-DIMM (not the same as a 72-pin SIMM), used for FPM DRAM and EDO DRAM
- 100-pin DIMM, used for printer SDRAM
- 144-pin SO-DIMM, used for SDR SDRAM (less frequently for DDR2 SDRAM)
- 168-pin DIMM, used for SDR SDRAM (less frequently for FPM/EDO DRAM in workstations/servers, may be 3.3 or 5 V)
- 172-pin MicroDIMM, used for DDR SDRAM
- 184-pin DIMM, used for DDR SDRAM
- 200-pin SO-DIMM, used for DDR SDRAM and DDR2 SDRAM
- 200-pin DIMM, used for FPM/EDO DRAM in some Sun workstations and servers.
201 to 300 pins
- 204-pin SO-DIMM, used for DDR3 SDRAM
- 214-pin MicroDIMM, used for DDR2 SDRAM
- 240-pin DIMM, used for DDR2 SDRAM, DDR3 SDRAM and FB-DIMM DRAM
- 244-pin MiniDIMM, used for DDR2 SDRAM
- 260-pin SO-DIMM, used for DDR4 SDRAM
- 260-pin SO-DIMM, with different notch position than on DDR4 SO-DIMMs, used for UniDIMMs that can carry either DDR3 or DDR4 SDRAM
- 278-pin DIMM, used for HP high density SDRAM.
- 288-pin DIMM, used for DDR4 SDRAM
168-pin SDRAM[edit]
Notch positions on DDR (top) and DDR2 (bottom) DIMM modules
On the bottom edge of 168-pin DIMMs there are two notches, and the location of each notch determines a particular feature of the module. The first notch is the DRAM key position, which represents RFU (reserved future use), registered, and unbuffered DIMM types (left, middle and right position, respectively). The second notch is the voltage key position, which represents 5.0 V, 3.3 V, and RFU DIMM types (order is the same as above).
DDR DIMMs[edit]
8 GB DDR4-2133 ECC 1.2 V RDIMMs
DDR, DDR2, DDR3 and DDR4 all have different pin counts, and different notch positions. As of August, 2014, DDR4 SDRAM is a modern emerging type of dynamic random access memory (DRAM) with a high-bandwidth ('double data rate') interface, and has been in use since 2013. It is the higher-speed successor to DDR, DDR2 and DDR3. DDR4 SDRAM is neither forward nor backward compatible with any earlier type of random access memory (RAM) because of different signalling voltages, timings, as well as other differing factors between the technologies and their implementation.
SPD EEPROM[edit]
A DIMM's capacity and other operational parameters may be identified with serial presence detect (SPD), an additional chip which contains information about the module type and timing for the memory controller to be configured correctly. The SPD EEPROM connects to the System Management Bus and may also contain thermal sensors (TS-on-DIMM).[1]
Error correction[edit]
ECC DIMMs are those that have extra data bits which can be used by the system memory controller to detect and correct errors. There are numerous ECC schemes, but perhaps the most common is Single Error Correct, Double Error Detect (SECDED) which uses an extra byte per 64-bit word. ECC modules usually carry a multiple of 9 instead of a multiple of 8 chips.
Ranking[edit]
Sometimes memory modules are designed with two or more independent sets of DRAM chips connected to the same address and data buses; each such set is called a rank. Ranks that share the same slot, only one rank may be accessed at any given time; it is specified by activating the corresponding rank's chip select (CS) signal. The other ranks on the module are deactivated for the duration of the operation by having their corresponding CS signals deactivated. DIMMs are currently being commonly manufactured with up to four ranks per module. Consumer DIMM vendors have recently begun to distinguish between single and dual ranked DIMMs.
After a memory word is fetched, the memory is typically inaccessible for an extended period of time while the sense amplifiers are charged for access of the next cell. By interleaving the memory (e.g. cells 0, 4, 8, etc. are stored together in one rank), sequential memory accesses can be performed more rapidly because sense amplifiers have 3 cycles of idle time for recharging, between accesses.
DIMMs are often referred to as 'single-sided' or 'double-sided' to describe whether the DRAM chips are located on one or both sides of the module's printed circuit board (PCB). However, these terms may cause confusion, as the physical layout of the chips does not necessarily relate to how they are logically organized or accessed.
JEDEC decided that the terms 'dual-sided', 'double-sided', or 'dual-banked' were not correct when applied to registered DIMMs (RDIMMs).
Organization[edit]
Most DIMMs are built using '×4' ('by four') or '×8' ('by eight') memory chips with nine chips per side; '×4' and '×8' refer to the data width of the DRAM chips in bits.
In the case of '×4' registered DIMMs, the data width per side is 36 bits; therefore, the memory controller (which requires 72 bits) needs to address both sides at the same time to read or write the data it needs. In this case, the two-sided module is single-ranked. For '×8' registered DIMMs, each side is 72 bits wide, so the memory controller only addresses one side at a time (the two-sided module is dual-ranked).
Tipos De Memorias Ram
The above example applies to ECC memory that stores 72 bits instead of the more common 64. There would also be one extra chip per group of eight, which is not counted.
Speeds[edit]
For various technologies, there are certain bus and device clock frequencies that are standardized; there is also a decided nomenclature for each of these speeds for each type.
DIMMs based on Single Data Rate (SDR) DRAM have the same bus frequency for data, address and control lines. DIMMs based on Double Data Rate (DDR) DRAM have data but not the strobe at double the rate of the clock; this is achieved by clocking on both the rising and falling edge of the data strobes. Power consumption and voltage gradually became lower with each generation of DDR-based DIMMs.
Chip | Module | Effective Clock | Voltage |
---|---|---|---|
SDR-66 | PC-66 | 66 MHz | 3.3 V |
SDR-100 | PC-100 | 100 MHz | 3.3 V |
SDR-133 | PC-133 | 133 MHz | 3.3 V |
Chip | Module | Memory Clock | I/O Bus Clock | Transfer rate | Voltage |
---|---|---|---|---|---|
DDR-200 | PC-1600 | 100 MHz | 100 MHz | 200 MT/s | 2.5 V |
DDR-266 | PC-2100 | 133 MHz | 133 MHz | 266 MT/s | 2.5 V |
DDR-333 | PC-2700 | 166 MHz | 166 MHz | 333 MT/s | 2.5 V |
DDR-400 | PC-3200 | 200 MHz | 200 MHz | 400 MT/s | 2.5 V |
Chip | Module | Memory Clock | I/O Bus Clock | Transfer rate | Voltage |
---|---|---|---|---|---|
DDR2-400 | PC2-3200 | 200 MHz | 200 MHz | 400 MT/s | 1.8 V |
DDR2-533 | PC2-4200 | 266 MHz | 266 MHz | 533 MT/s | 1.8 V |
DDR2-667 | PC2-5300 | 333 MHz | 333 MHz | 667 MT/s | 1.8 V |
DDR2-800 | PC2-6400 | 400 MHz | 400 MHz | 800 MT/s | 1.8 V |
DDR2-1066 | PC2-8500 | 533 MHz | 533 MHz | 1066 MT/s | 1.8 V |
Chip | Module | Memory Clock | I/O Bus Clock | Transfer rate | Voltage |
---|---|---|---|---|---|
DDR3-800 | PC3-6400 | 400 MHz | 400 MHz | 800 MT/s | 1.5 V |
DDR3-1066 | PC3-8500 | 533 MHz | 533 MHz | 1066 MT/s | 1.5 V |
DDR3-1333 | PC3-10600 | 667 MHz | 667 MHz | 1333 MT/s | 1.5 V |
DDR3-1600 | PC3-12800 | 800 MHz | 800 MHz | 1600 MT/s | 1.5 V |
DDR3-1866 | PC3-14900 | 933 MHz | 933 MHz | 1866 MT/s | 1.5 V |
DDR3-2133 | PC3-17000 | 1066 MHz | 1066 MHz | 2133 MT/s | 1.5 V |
DDR3-2400 | PC3-19200 | 1200 MHz | 1200 MHz | 2400 MT/s | 1.5 V |
Chip | Module | Memory Clock | I/O Bus Clock | Transfer rate | Voltage |
---|---|---|---|---|---|
DDR4-1600 | PC4-12800 | 800 MHz | 800 MHz | 1600 MT/s | 1.2 V |
DDR4-1866 | PC4-14900 | 933 MHz | 933 MHz | 1866 MT/s | 1.2 V |
DDR4-2133 | PC4-17000 | 1066 MHz | 1066 MHz | 2133 MT/s | 1.2 V |
DDR4-2400 | PC4-19200 | 1200 MHz | 1200 MHz | 2400 MT/s | 1.2 V |
DDR4-2666 | PC4-21300 | 1333 MHz | 1333 MHz | 2666 MT/s | 1.2 V |
DDR4-3200 | PC4-25600 | 1600 MHz | 1600 MHz | 3200 MT/s | 1.2 V |
Form factors[edit]
Several form factors are commonly used in DIMMs. Single Data Rate Synchronous DRAM (SDR SDRAM) DIMMs were primarily manufactured in 1.5 inches (38 mm) and 1.7 inches (43 mm) heights. When 1U rackmount servers started becoming popular, these form factor registered DIMMs had to plug into angled DIMM sockets to fit in the 1.75 inches (44 mm) high box. To alleviate this issue, the next standards of DDR DIMMs were created with a 'low profile' (LP) height of around 1.2 inches (30 mm). These fit into vertical DIMM sockets for a 1U platform.
With the advent of blade servers, angled slots have once again become common in order to accommodate LP form factor DIMMs in these space-constrained boxes. This led to the development of the Very Low Profile (VLP) form factor DIMM with a height of around 0.72 inches (18 mm). The DDR3 JEDEC standard for VLP DIMM height is around 0.740 inches (18.8 mm). These will fit vertically in ATCA systems.
Full-height 240-pin DDR2 and DDR3 DIMMs are all specified at a height of around 1.18 inches (30 mm) by standards set by JEDEC. These form factors include 240-pin DIMM, SODIMM, Mini-DIMM and Micro-DIMM.[2]
Full-height 288-pin DDR4 DIMMs are slightly taller than their DDR3 counterparts at 1.23 inches (31 mm). Similarly, VLP DDR4 DIMMs are also marginally taller than their DDR3 equivalent at nearly 0.74 inches (19 mm).[3]
As of Q2 2017, Asus has had a PCI-E based 'DIMM.2', which has a similar socket to DDR3 DIMMs and is used to put in a module to connect up to two M.2NVMe solid-state drives. However, it cannot use common DDR type ram and does not have much support other than Asus.[citation needed]
See also[edit]
- Dual in-line package (DIP)
- Memory geometry – logical configuration of RAM modules (channels, ranks, banks, etc.)
- NVDIMM – non-volatile DIMM
- Rambus in-line memory module (RIMM)
- Single in-line memory module (SIMM)
- Single in-line package (SIP)
- Zig-zag in-line package (ZIP)
References[edit]
- ^Temperature Sensor in DIMM memory modules
- ^JEDEC MO-269J Whitepaper., accessed Aug. 20, 2014.
- ^JEDEC MO-309E Whitepaper., accessed Aug. 20, 2014.
External links[edit]
Wikimedia Commons has media related to DIMM. |
Retrieved from 'https://en.wikipedia.org/w/index.php?title=DIMM&oldid=895205351'
Type | LGA |
---|---|
Processor dimensions | 37.5 × 37.5 mm2[1] |
Processors | Sandy Bridge, Ivy Bridge |
Predecessor | LGA 1156 |
Successor | LGA 1150 |
Memory support | DDR3 |
This article is part of the CPU socket series |
View of the socket LGA 1155 on an Intel Core i7 Sandy Bridge 2600K model CPU
LGA 1155, also called Socket H2, is a socket used for Intelmicroprocessors based on Sandy Bridge (2nd-Gen, 32nm, 2k-series) and Ivy Bridge (3rd-Gen, 22nm, 3k-series) microarchitectures.
It is the successor of LGA 1156 (known as Socket H) and was itself succeeded by LGA 1150 in 2013. Along with selected variations of LGA 2011 socket, it was the last Intel socket to fully support Windows XP and Windows Server 2003 (only with 6 series chipsets, 7 series chipsets have limited support). Sandy Bridge-based processors are also the last to support Windows Vista.
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LGA 1155 has 1155 protruding pins to make contact with the pads on the processor. The pins are arranged in a 40×40 array with a 24×16 central void and additional 61 omitted pins (two adjoining the central void, six in each of the four corners, and 35 in groups around the perimeter), yielding the 1600 − 384 − 61 = 1155 pin count. Processors for LGA 1155 and LGA 1156 sockets are not compatible with each other since they have different socket notches.
LGA 1155 also marked the beginning of secure boot with support in some later boards.
Heatsink[edit]
The 4 holes for fastening the heatsink to the motherboard are placed in a square with a lateral length of 75 mm for Intel's sockets LGA 1156, LGA 1155, LGA 1150 and LGA 1151. Cooling solutions should therefore be interchangeable.
Cooling systems are compatible between LGA 1155 and LGA 1156 sockets, as the processors have the same dimensions, profile and construction, and similar levels of heat production.[2]
Sandy Bridge family of chipsets[edit]
Sandy Bridge chipsets, except B65, Q65 and Q67, support both Sandy Bridge and Ivy Bridge CPUs through a BIOS upgrade.[3] Sandy Bridge based processors officially support up to DDR3-1333 memory, however in practice speeds up to DDR3-2133 have been tested to work successfully.[4]
The H61 chipset only supports one double-sided DIMM Memory module (RAM module) per memory-channel and therefore is limited to 16 GB instead of the 32 GB like the others support.[5] On H61-based motherboards with four DIMM slots, only four single-sided DIMMs can be installed.[6]
Name[7] | H61 | B65 | Q65 | Q67 | H67[8] | P67 | Z68[9] |
---|---|---|---|---|---|---|---|
Overclocking | GPU | CPU + RAM | CPU + GPU + RAM | ||||
Allows using built-in GPU with Intel Clear Video Technology | Yes | No | Yes | ||||
Maximum USB 2.0 ports[a] | 10 | 12 | 14 | ||||
Maximum SATA 2.0/3.0 ports | 4 / 0 | 4 / 1 | 4 / 2 | ||||
Main PCIe configuration | 1 × PCIe 2.0 ×16 |
| |||||
Secondary PCIe | 6 × PCIe 2.0 ×1 | 8 × PCIe 2.0 ×1 | |||||
Conventional PCI support[b] | No | Yes | No | ||||
Intel Rapid Storage Technology (RAID) | No | Yes | |||||
Smart Response Technology | No | Yes | |||||
Ivy Bridge processor support | Yes | No | Yes | ||||
Intel Active Management, Trusted Execution, Anti-Theft, and vPro Technology | No | Yes | No | ||||
Release date | February 2011 | May 2011 | January 2011 | May 2011 | |||
Maximum TDP | 6.1 W | ||||||
Chipset lithography | 65 nm |
Ivy Bridge family of chipsets[edit]
All Ivy Bridge chipsets and motherboards support both Sandy Bridge and Ivy Bridge CPUs. Ivy Bridge based processors will officially support up to DDR3-1600, up from DDR3-1333 of Sandy Bridge. Some consumer Ivy Bridge chipsets will also allow overclocking of K-series processors.[10]
Name[11] | B75 | Q75 | Q77 | H77 | Z75 | Z77 |
---|---|---|---|---|---|---|
Overclocking | CPU (Bclk) + GPU | CPU + GPU + RAM | ||||
Allows using built-in GPU | Yes | |||||
Intel Clear Video Technology | Yes | |||||
RAID | No | Yes | ||||
Maximum USB 2.0/3.0 ports | 8 / 4 | 10 / 4 | ||||
Maximum SATA 2.0/3.0 ports | 5 / 1 | 4 / 2 | ||||
Main PCIe configuration[c] | 1 × PCIe 3.0 ×16 |
| ||||
Secondary PCIe | 8 PCIe 2.0 ×1 | |||||
Conventional PCI[b] | Yes | No [12] | ||||
Intel Rapid Storage Technology | No | Yes | ||||
Intel Anti-Theft Technology | Yes | |||||
Smart Response Technology | No | Yes | No | Yes | ||
Intel vPro | No | Yes | No | |||
Release date | April 2012[13] | |||||
Maximum TDP | 6.7 W | |||||
Chipset lithography | 65 nm[14] |
NVMe[edit]
A PCGHX user[who?] wrote an article on the website de:PC Games Hardware describing how to take UEFI modules from some Z97 motherboards and use them with an Z77-motherboard to make the later support booting from an SSD using the NVM Express protocol, instead of the AHCI protocol.[15] That article claims, the Z97 motherboards were the first to officially and fully support the NVMe protocol.
Als Erstes gilt es die fraglichen Module aus einem möglichst ähnlichen BIOS der Z97-Generation zu extrahieren. Dies ist die erste Generation von Mainboards, die NVMe-Laufwerke nativ unterstützt.
The mods described also work with B75 Chipset motherboards.
Notes[edit]
- ^USB 3.0 is not supported by any of these chipsets. Motherboard manufacturers may use external hardware to add USB 3.0 support.
- ^ abAlthough some of the chipsets do not support conventional PCI, motherboard manufacturers may include support through the addition of third-party PCI bridges.
- ^For PCIe 3.0 capability, the Ivy Bridge CPU must have the relevant PCIe 3.0 controller built in. However, some Ivy Bridge CPUs only have a PCIe 2.0 controller built in.
Memoria Ram Definicion
References[edit]
Memorias Ram Para Pc
- ^'Intel Core 2 gen CPUs and Socket 1155 Datasheet'(PDF).
- ^'2nd Gen Intel Core Processor, LGA1155 Socket:'(PDF). Download.intel.com. Archived from the original(PDF) on 2011-07-13. Retrieved 2012-09-26.
- ^'Ivy Bridge Quad-Core to Have 77W TDP, Intel Plans for LGA1155 Ivy Bridge Entry'. techPowerUp. Retrieved 2012-09-26.
- ^'Sandy Bridge Memory Scaling: Choosing the Best DDR3'. AnandTech. Retrieved 2012-09-26.
- ^'Intel H61 Express Chipset'. Intel.com. Retrieved 2012-09-26.
- ^'Motherboards- ASUS P8H61 EVO'. ASUS. Retrieved 2012-09-26.
- ^'ARK - Compare Intel Products'. Intel ARK (Product Specs).
- ^'Intel H67 Express Chipset'. Intel.com. Retrieved 2012-09-26.
- ^'Intel SSD Caching Feature for Z68 Chipset Explored'. Vr-zone.com. 2011-04-25. Retrieved 2012-09-26.
- ^'Intel's Roadmap: Ivy Bridge, Panther Point, and SSDs'. AnandTech. Retrieved 2012-09-26.
- ^'ARK - Compare Intel Products'. Intel ARK (Product Specs).
- ^'Intel 7 Series Chipset Family PCH: Datasheet'. Intel.com. Retrieved 2014-12-02.
- ^'Intel 7-Series Chipset Officially Debuts, Derived Desktop Board Products Launched'. techPowerUp. Retrieved 2012-09-26.
- ^'ARK | Intel Z77 Express Chipset (Intel BD82Z77 PCH)'. Ark.intel.com. Retrieved 2012-09-26.
- ^'Booten von einer NVMe-SSD'. 2016-10-13.
External links[edit]
Memoria Ram Wikipedia
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